Features: 

1) The key parts for the diodes, thyristors and transistors 

2) 6 series: 

    a) Kinds of PNP/NPN transistor and diode chips in wafer form 

        (3" and 4")

    b) Dies (fusion) for power thyristor (SCR), diode and triac

    c) Cap and header for TO-3, TO-18, TO-39 

    d) Stud package of glass to metal and ceramic to metal 

    e) Ceramic ring and disc type package (housing)

    f) Moly disc

Features: 
1) Finished assy has a helium leak rate less than 10e (-8) cc/sec 
2) No pits, cracks, ripples, scratches 
3) From φ1.0" to 4.0" available
4) OEM acceptable

Features: 

1) Spec: from φ3mm to 150mm with difference thickness 

2) Hardness: >240hv 

3) Clean, degreased and packaged in an inert atmosphere (or vacuum) 

    to prevent oxidation 

4) Plated Rh and Ni are available 

5) OEM acceptable

Features: 

1) With good airtight joint between glass to metal 

2) OEM acceptable

Features: 

1) Cap and head for TO-18, TO-39, B-1, B-4, TO-5  

2) With good airtight joint 

3) Material options:

    a) Nickle 99.2 - 99.4

    b) Steel nickle clad 3 - 6 micro

    c) Steel electroless nickle plated 3 - 6 micron

    d) Gold plated by selection

4)OEM acceptable